Siltronic AG
🏢 View company profile →299Patents
256Active
299Granted
57Portfolio score
Filing activity: Oct 22, 1999 → Jan 23, 2023 · 88 expiring within 5 years
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6899762B2 | Epitaxially coated semiconductor wafer and process for producing it | Emerging Cross-Sectional Technologies | 27 | Expired |
| US8088219B2 | Monocrystalline semiconductor wafer comprising defect-reduced regions and method for producing it | Emerging Cross-Sectional Technologies | 21 | Active |
| US6861360B2 | Double-sided polishing process for producing a multiplicity of silicon semiconductor wafers | Performing Operations; Transporting | 14 | Expired |
| US7785706B2 | Semiconductor wafer and process for its production | Emerging Cross-Sectional Technologies | 13 | Active |
| US7828893B2 | Silicon wafer and process for the heat treatment of a silicon wafer | Emerging Cross-Sectional Technologies | 11 | Active |
| US9458554B2 | Semiconductor wafer composed of monocrystalline silicon and method for producing it | Emerging Cross-Sectional Technologies | 11 | Active |
| US8376811B2 | Method for the double sided polishing of a semiconductor wafer | Performing Operations; Transporting | 11 | Active |
| US7935614B2 | Epitaxially coated silicon wafer and method for producing epitaxially coated silicon wafers | Emerging Cross-Sectional Technologies | 11 | Active |
| US8395164B2 | Multilayered semiconductor wafer and process for manufacturing the same | Electricity | 11 | Active |
| US8113913B2 | Method for the simultaneous grinding of a plurality of semiconductor wafers | Performing Operations; Transporting | 11 | Active |
| US7867059B2 | Semiconductor wafer, apparatus and process for producing the semiconductor wafer | Performing Operations; Transporting | 9 | Active |
| US6773333B2 | Method for cutting slices from a workpiece | Performing Operations; Transporting | 9 | Expired |
| US6995077B2 | Epitaxially coated semiconductor wafer and process for producing it | Emerging Cross-Sectional Technologies | 8 | Expired |
| US8372298B2 | Method for producing epitaxially coated silicon wafers | Electricity | 8 | Active |
| US11380621B2 | Susceptor for holding a semiconductor wafer having an orientation notch, a method for depositing a layer on a semiconductor wafer, and semiconductor wafer | Electricity | 8 | Active |
| US7052948B2 | Film or layer made of semi-conductive material and method for producing said film or layer | Electricity | 8 | Expired |
| US6793837B2 | Process for material-removing machining of both sides of semiconductor wafers | Performing Operations; Transporting | 8 | Expired |
| US7416962B2 | Method for processing a semiconductor wafer including back side grinding | Electricity | 8 | Expired |
| US7793647B2 | Method and device for sawing a workpiece | Emerging Cross-Sectional Technologies | 7 | Active |
| US7208043B2 | Silicon semiconductor substrate and preparation thereof | Emerging Cross-Sectional Technologies | 7 | Expired |
| US7276168B2 | Method for supply of constant-concentration ozonated water | Chemistry; Metallurgy | 7 | Expired |
| US7077726B2 | Semiconductor wafer with improved local flatness, and method for its production | Emerging Cross-Sectional Technologies | 7 | Expired |
| US11869942B2 | Heteroepitaxial wafer and method for producing a heteroepitaxial wafer | Electricity | 7 | Active |
| US7815489B2 | Method for the simultaneous double-side grinding of a plurality of semiconductor wafers | Performing Operations; Transporting | 7 | Active |
| US7938911B2 | Process for cleaning a semiconductor wafer using a cleaning solution | Chemistry; Metallurgy | 7 | Active |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.