Semiconductor device
US10847190B2 · kind B2 · utility
2Cited by
12References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 8, 2020 |
| Grant date | Nov 24, 2020 |
| Priority date | — |
| Expiry date | Jan 8, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2213/0032
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
According to an embodiment, a semiconductor device includes a substrate, a connector, a volatile semiconductor memory element, multiple nonvolatile semiconductor memory elements, and a controller. A wiring pattern includes a signal line that is formed between the connector and the controller and that connects the connector to the controller. On the opposite side of the controller to the signal line, the multiple nonvolatile semiconductor memory elements are aligned along the longitudinal direction of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.