Patent · US Active

Lead frame with selective patterned plating

US10847449B2 · kind B2 · utility

0Cited by

7References

19Claims

0Family size

Assignee

NXP USA, Inc. · US

Inventors

Meijiang Song · Tianjin, CN
Allen Marfil Descartin · Caliclic, PH
Mariano Layson Ching, Jr. · Tianjin, CN
Lidong Zhang · Hagfors, SE
Jun Li · Tianjin, CN

Key dates

Filing date	Mar 28, 2019
Grant date	Nov 24, 2020
Priority date	—
Expiry date	Mar 28, 2039

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A copper lead frame used in the assembly of a semiconductor device includes a die flag and lead fingers extending away from the die flag. Each lead finger has a proximal end near the die flag and a distal end further away from the die flag. Metal plating is formed on the lead fingers, where first lead fingers have the metal plating on their proximal ends and second lead fingers have the metal plating on their distal ends. The first and second lead fingers are arranged alternately around the die flag.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.