Power-delivery methods for embedded multi-die interconnect bridges and methods of assembling same
US10847467B2 · kind B2 · utility
16Cited by
2References
20Claims
0Family size
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Key dates
| Filing date | Oct 21, 2019 |
| Grant date | Nov 24, 2020 |
| Priority date | — |
| Expiry date | Oct 21, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15192
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An embedded multi-die interconnect bridge (EMIB) die is configured with power delivery to the center of the EMIB die and the power is distributed to two dice that are interconnected across the EMIB die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.