Semiconductor package structure and method for manufacturing the same
US10847470B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 5, 2018 |
| Grant date | Nov 24, 2020 |
| Priority date | — |
| Expiry date | Feb 5, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package structure includes a first conductive structure, a second conductive structure, a first semiconductor component, a second semiconductor component and a first encapsulant. The first semiconductor component is disposed on the first conductive structure. The first conductive structure includes a first redistribution layer. The second semiconductor component is disposed on the second conductive structure. The second conductive structure includes a second redistribution layer, and the first conductive structure is electrically connected to the second conductive structure. The first encapsulant covers the first semiconductor component and the first conductive structure. A lateral surface of the first conductive structure and a lateral surface of the first encapsulant are non-coplanar.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.