SNAP-RF interconnections
US10849219B2 · kind B2 · utility
1Cited by
18References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 27, 2019 |
| Grant date | Nov 24, 2020 |
| Priority date | — |
| Expiry date | Mar 8, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0228
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A radio frequency connector includes a substrate, a first ground plane disposed upon the substrate, a signal conductor having a first contact point, with the first contact point being configured to electrically mate with a second contact point, and a first ground boundary configured to electrically mate with a second ground boundary, with the first ground boundary being formed as an electrically continuous conductor within the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.