Printed circuit board and method of manufacturing the same
US10849226B2 · kind B2 · utility
1Cited by
3References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 25, 2019 |
| Grant date | Nov 24, 2020 |
| Priority date | — |
| Expiry date | Oct 25, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0733
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board includes: an insulating layer having a via hole formed therein; a single layer metal pad disposed in the insulating layer and having a center portion that is exposed by the via hole, the center portion of the pad having a higher roughness than peripheral portions of the pad; and a via formed in the via hole and connected to the center portion of the pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.