Polishing apparatus with a waste liquid receiver
US10850365B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Aug 3, 2016 |
| Grant date | Dec 1, 2020 |
| Priority date | — |
| Expiry date | Oct 23, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/10
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing apparatus including: a turntable with an attached polishing pad; a polishing head that holds a wafer; a tank that stores a polishing agent; a polishing agent supply mechanism which supplies the stored polishing agent to the polishing pad; a waste liquid receiver which collects the polishing agent flowing from the turntable; and a circulation mechanism which is connected to the waste liquid receiver and supplies the collected polishing agent to the tank, the polishing agent is supplied to the polishing pad from the tank with the polishing agent supply mechanism, the used polishing agent which flows from the turntable is collected by the waste liquid receiver, a surface of the wafer held by the polishing head is rubbed against the pad to polish it while supplying the collected polishing agent to the tank to circulate the polishing agent, and the waste liquid receiver is fixed to the turntable and the waste liquid receiver having a bottom plate and a removable side plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.