SHIN-ETSU HANDOTAI CO., LTD.
1,107Patents
386Active
1,107Granted
53Portfolio score
Filing activity: Jan 24, 1983 → Feb 25, 2022 · 127 expiring within 5 years
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6569239B2 | Silicon epitaxial wafer and production method therefor | Chemistry; Metallurgy | 528 | Expired |
| US7393207B2 | Wafer support tool for heat treatment and heat treatment apparatus | Electricity | 459 | Expired |
| US5152857A | Method for preparing a substrate for semiconductor devices | Emerging Cross-Sectional Technologies | 299 | Expired |
| US6814811B2 | Semiconductor wafer and vapor phase growth apparatus | Emerging Cross-Sectional Technologies | 270 | Expired |
| US6372609B1 | Method of Fabricating SOI wafer by hydrogen ION delamination method and SOI wafer fabricated by the method | Electricity | 270 | Expired |
| US6245647A | Method for fabrication of thin film | Electricity | 266 | Expired |
| US5081795A | Polishing apparatus | Performing Operations; Transporting | 155 | Expired |
| US5584746A | Method of polishing semiconductor wafers and apparatus therefor | Performing Operations; Transporting | 111 | Expired |
| US7230680B2 | Wafer flatness evaluation method, wafer flatness evaluation apparatus carrying out the evaluation method, wafer manufacturing method using the evaluation method, wafer quality assurance method using the evaluation method, semiconductor device manufacturing method using the evaluation method and semiconductor device manufacturing method using a wafer evaluated by the evaluation method | Electricity | 104 | Expired |
| US5942445A | Method of manufacturing semiconductor wafers | Electricity | 97 | Expired |
| US6589447B1 | Compound semiconductor single crystal and fabrication process for compound semiconductor device | Emerging Cross-Sectional Technologies | 94 | Expired |
| US8141484B2 | Screen printing plate and screen printing apparatus | Electricity | 88 | Active |
| US5333413A | Automatic wafer lapping apparatus | Electricity | 88 | Expired |
| US6884154B2 | Method for apparatus for polishing outer peripheral chamfered part of wafer | Performing Operations; Transporting | 85 | Expired |
| US5749974A | Method of chemical vapor deposition and reactor therefor | Chemistry; Metallurgy | 78 | Expired |
| US5390811A | Wafer basket for containing semiconductor wafers | Performing Operations; Transporting | 71 | Expired |
| US5485021A | Semiconductor device with optical waveguides to achieve signal transmission using optical means | Electricity | 67 | Expired |
| US5968264A | Method and apparatus for manufacturing a silicon single crystal having few crystal defects, and a silicon single crystal and silicon wafers manufactured by the same | Emerging Cross-Sectional Technologies | 65 | Expired |
| US5317778A | Automatic cleaning apparatus for wafers | Emerging Cross-Sectional Technologies | 62 | Expired |
| US6596610B1 | Method for reclaiming delaminated wafer and reclaimed delaminated wafer | Emerging Cross-Sectional Technologies | 62 | Expired |
| US5191738A | Method of polishing semiconductor wafer | Performing Operations; Transporting | 61 | Expired |
| US6234879A | Method and apparatus for wafer chamfer polishing | Performing Operations; Transporting | 59 | Expired |
| US5879220A | Apparatus for mirror-polishing thin plate | Performing Operations; Transporting | 59 | Expired |
| US6140210A | Method of fabricating an SOI wafer and SOI wafer fabricated thereby | Electricity | 57 | Expired |
| US6544656B1 | Production method for silicon wafer and silicon wafer | Emerging Cross-Sectional Technologies | 56 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.