Micromechanical sensor and methods for producing a micromechanical sensor and a micromechanical sensor element

US10852319B2 · kind B2 · utility

Assignee

• Infineon Technologies Dresden GmbH & Co. KG · DE

Inventors

• Erhard Landgraf · Dresden, DE
• Stephan Gerhard Albert · Munich, DE
• Steffen Bieselt · Wehlen, DE
• Sebastian PREGL · Dresden, DE
• Matthias Rose · Eindhoven, NL

Key dates

• Filing date: Jun 26, 2018
• Grant date: Dec 1, 2020
• Expiry date: Feb 8, 2039

Classification

• Technology area (CPC G): Physics
• CPC primary: G01P2015/088
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A micromechanical sensor includes a first and a second capacitive sensor element each having a first and a second electrode, wherein electrode wall surfaces of the first electrode and the second electrode are situated opposite one another in a first direction and form a capacitance, wherein the first electrodes are movable in a second direction, which is different than the first direction, in response to a variable to be detected, and the second electrodes are stationary. The electrode wall surface of the first electrode of the first sensor element has a smaller extent in the second direction than the opposite electrode wall surface of the second electrode of the first sensor element. The electrode wall surface of the second electrode of the second sensor element has a smaller extent in the second direction than the opposite electrode wall surface of the first electrode of the second sensor element.