Patent · US Active

Dynamic leveling process heater lift

US10854491B2 · kind B2 · utility

1Cited by

0References

11Claims

0Family size

Assignee

Applied Materials, Inc. · US

Inventors

Jason M. Schaller · Austin, US
Michael Paul Rohrer · Cedar Park, US
Tuan Nguyen · Woburn, US
William T. Weaver · Austin, US
Gregory John Freeman · Austin, US
Robert Brent Vopat · Austin, US

Key dates

Filing date	Mar 18, 2019
Grant date	Dec 1, 2020
Priority date	—
Expiry date	Mar 18, 2039

Classification

Technology area (CPC G)Physics
CPC primaryG05B2219/45031
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method and apparatus for of improving processing results in a processing chamber by orienting a substrate support relative to a surface within the processing chamber. The method comprising orienting a supporting surface of a substrate support in a first orientation relative to an output surface of a showerhead, where the first orientation of the supporting surface relative to the output surface is not coplanar, and depositing a first layer of material on a substrate disposed on the supporting surface that is oriented in the first orientation.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.