Patent · US Active

Fingerprint chip package and method for processing same

US10854536B2 · kind B2 · utility

0Cited by

1References

5Claims

0Family size

Assignee

SHENZHEN GOODIX TECHNOLOGY CO., LTD. · CN

Inventors

Shanshan Zeng · Kowloon, CN
Penghui WANG · Beijing, CN
Junping Luo · Tangxia, CN

Key dates

Filing date	Sep 17, 2018
Grant date	Dec 1, 2020
Priority date	—
Expiry date	Sep 17, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/00014
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A fingerprint chip package and method for processing same, relating to a field of biometric identification. The fingerprint chip package includes: a lead frame (1), a chip (2), and a plastic packaging part enclosing the lead frame (1) and the chip (2); the lead frame (1) comprises a base island (13), a connecting rib (11), and a golden finger (12); the base island (13) is used for bearing the chip (2); the connecting rib (11) is used for supporting the lead frame (1) and connecting the base island (13) via the golden finger (12); and the golden finger (12) is used for fixing the base island (13) and electrically connecting with the chip (2).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.