Junping Luo
2Patents
0h-index
2Co-inventors
18Inventor score
Filing activity: Sep 17, 2018 → Oct 25, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10727196B2 | Chip packaging structure and packaging method | Electricity | 0 | Active |
| US10854536B2 | Fingerprint chip package and method for processing same | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.