Photon extraction from ultraviolet light-emitting devices
US10854797B2 · kind B2 · utility
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13References
28Claims
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Key dates
| Filing date | May 24, 2019 |
| Grant date | Dec 1, 2020 |
| Priority date | — |
| Expiry date | May 24, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/855
Abstract
In various embodiments, a layer of organic encapsulant is provided over a surface of an ultraviolet (UV) light-emitting semiconductor die, and at least a portion of the encapsulant is exposed to UV light to convert at least some of said portion of the encapsulant into non-stoichiometric silica material. The non-stoichiometric silica material includes silicon, oxygen, and carbon, and a carbon content of the non-stoichiometric silica material is greater than 1 ppm and less than 40 atomic percent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.