Antenna package structure and antenna packaging method
US10854951B2 · kind B2 · utility
0Cited by
1References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 14, 2019 |
| Grant date | Dec 1, 2020 |
| Priority date | — |
| Expiry date | Mar 14, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15321
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
The present disclosure provides an antenna package structure and an antenna packaging method for a semiconductor chip. The package structure includes an antenna circuit chip, a first rewiring layer, an antenna structure, a second metal connecting column, a second packaging layer, a second antenna metal layer, and a second metal bump. The antenna circuit chip, the antenna structure, and the second antenna metal layer are interconnected by using two rewiring layers and two layers of metal connecting columns.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.