Electronic assembly that includes void free holes
US10856424B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 25, 2015 |
| Grant date | Dec 1, 2020 |
| Priority date | — |
| Expiry date | Jul 20, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4602
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method that includes electroplating both sides of a core and the through hole of a core with a conductive material to cover both sides of the core with the conductive material and to form a conductive bridge in the through hole, wherein the core has a thickness greater than 200 microns; etching the conductive material that covers both sides of the core to reduce the thickness of the conductive material to about 1 micron; applying a film resist to the core; exposing and developing the resist film to form patterns on the conductive material on both sides of the core; and electroplating additional conductive material on the (i) conductive material on both sides of the core (ii) conductive material within the through hole; and (iii) conductive bridge to fill the through hole with conductive material without any voids and to form conductive patterns on both sides of the core.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.