Inventor · Scottsdale, AZ, US

Amanda E. Schuckman

21Patents
4h-index
26Co-inventors
59Inventor score

Filing activity: May 13, 2013 → Apr 26, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US9147663B2 Bridge interconnection with layered interconnect structures Electricity 28 Active
US9917044B2 Package with bi-layered dielectric structure Electricity 11 Active
US9640485B2 Bridge interconnection with layered interconnect structures Electricity 6 Active
US9837341B1 Tin-zinc microbump structures Electricity 4 Active
US10685850B2 High density organic interconnect structures Electricity 3 Active
US10297563B2 Copper seed layer and nickel-tin microbump structures Electricity 3 Active
US9953959B1 Metal protected fan-out cavity Electricity 3 Active
US11133257B2 Bridge interconnection with layered interconnect structures Electricity 2 Active
US11694960B2 Bridge interconnection with layered interconnect structures Electricity 1 Active
US10373900B2 Tin-zinc microbump structures and method of making same Electricity 0 Active
US9741606B2 Desmear with metalized protective film Electricity 0 Active
US11631595B2 High density organic interconnect structures Electricity 0 Active
US10103103B2 Bridge interconnection with layered interconnect structures Electricity 0 Active
US10553453B2 Systems and methods for semiconductor packages using photoimageable layers Electricity 0 Active
US10475745B2 Bridge interconnection with layered interconnect structures Electricity 0 Active
US8877632B1 Providing a void-free filled interconnect structure in a layer of package substrate Electricity 0 Active
US10856424B2 Electronic assembly that includes void free holes Electricity 0 Active
US10916486B2 Semiconductor device including silane based adhesion promoter and method of making Electricity 0 Active
US12062551B2 High density organic interconnect structures Electricity 0 Active
US12132002B2 Bridge interconnection with layered interconnect structures Electricity 0 Active
US11195727B2 High density organic interconnect structures Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.