Method and apparatus for performing a polishing process in semiconductor fabrication
US10857649B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 22, 2011 |
| Grant date | Dec 8, 2020 |
| Priority date | — |
| Expiry date | Sep 28, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B9/065
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present disclosure provides an apparatus for fabricating a semiconductor device. The apparatus includes a polishing head that is operable to perform a polishing process to a wafer. The apparatus includes a retaining ring that is rotatably coupled to the polishing head. The retaining ring is operable to secure the wafer to be polished. The apparatus includes a soft material component located within the retaining ring. The soft material component is softer than silicon. The soft material component is operable to grind a bevel region of the wafer during the polishing process. The apparatus includes a spray nozzle that is rotatably coupled to the polishing head. The spray nozzle is operable to dispense a cleaning solution to the bevel region of the wafer during the polishing process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.