Resin composition and pre-preg and laminate using the composition
US10858514B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 18, 2015 |
| Grant date | Dec 8, 2020 |
| Priority date | — |
| Expiry date | Dec 21, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2201/02
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Copper clad laminates and a resin composition and a pre-preg and a laminate using the composition. The resin composition contains: (A) a prepolymer of vinyl thermosetting polyphenylene ether and a bifunctional maleimide or a multifunctional maleimide; and, (B) a polyolefin resin. Employing the prepolymer of vinyl thermosetting polyphenylene ether and the bifunctional maleimide or the multifunctional maleimide, solves the problem of incompatibility of the bifunctional maleimide or the multifunctional maleimide with the vinyl thermosetting polyphenylene ether and the polyolefin resin. An aqueous glue solution so mixed is uniform and consistent, the prepreg has a uniform expression, and a substrate resin area is free of a phase-separation problem.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.