Protective film forming resin agent and laser processing method
US10858524B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 15, 2016 |
| Grant date | Dec 8, 2020 |
| Priority date | — |
| Expiry date | Mar 16, 2038 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K2003/2241
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Disclosed herein is a protective film forming resin agent to be used for laser processing including a water-soluble resin, and particulates of a metal oxide which are dispersed in an aqueous solution of the resin and a section of which has an elongated shape having a major axis and a minor axis orthogonal to the major axis. The particulates of the metal oxide the section of which has the elongated shape having the major axis and the minor axis orthogonal to the major axis are dispersed in the aqueous solution of the resin. When the aqueous solution is applied to a workpiece to form a protective film on the workpiece and then the workpiece is subjected to laser processing, therefore, absorbance of a laser beam in the protective film is enhanced, so that processing efficiency is enhanced.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.