Wafer probe card integrated with a light source facing a device under test side and method of manufacturing
US10859625B2 · kind B2 · utility
0Cited by
9References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 21, 2018 |
| Grant date | Dec 8, 2020 |
| Priority date | — |
| Expiry date | Jan 29, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/31908
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An integrated wafer probe card with a light source facing a device under test (DUT) side and enabling methodology are provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.