System and method for measurement of complex structures
US10861755B2 · kind B2 · utility
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2References
20Claims
0Family size
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Key dates
| Filing date | Jan 31, 2018 |
| Grant date | Dec 8, 2020 |
| Priority date | — |
| Expiry date | Jan 9, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01B2210/56
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A system and method of use for simplifying the measurement of various properties of complex semiconductor structures is provided. The system and method supports reduction of structure complexity and modeling for optical monitoring and permits determination of film thicknesses and feature depths during semiconductor manufacturing processes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.