Image sensor with an absorption enhancement semiconductor layer
US10861988B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 13, 2019 |
| Grant date | Dec 8, 2020 |
| Priority date | — |
| Expiry date | Nov 13, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/8063
Abstract
An image sensor with an absorption enhancement semiconductor layer is provided. In some embodiments, the image sensor comprises a front-side semiconductor layer, an absorption enhancement semiconductor layer, and a back-side semiconductor layer that are stacked. The absorption enhancement semiconductor layer is stacked between the front-side and back-side semiconductor layers. The absorption enhancement semiconductor layer has an energy bandgap less than that of the front-side semiconductor layer. Further, the image sensor comprises a plurality of protrusions and a photodetector. The protrusions are defined by the back-side semiconductor layer, and the photodetector is defined by the front-side semiconductor layer, the absorption enhancement semiconductor layer, and the back-side semiconductor layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.