Integrated circuit with capacitor in different layer than transmission line
US10862185B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 21, 2018 |
| Grant date | Dec 8, 2020 |
| Priority date | — |
| Expiry date | Oct 20, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D86/85
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit can include a first capacitor in a first end portion of the integrated circuit and including a first plate and a second plate, the first plate of the first capacitor being electrically coupled to ground and within a first metal layer of the integrated circuit, a first transmission line electrically coupled to the second plate of the first capacitor, the first transmission line being within a second metal layer of the integrated circuit, a second capacitor in a second end portion of the integrated circuit and including a first plate and a second plate, the first plate of the second capacitor being electrically coupled to ground and within the first metal layer of the integrated circuit, and a second transmission line electrically coupled to the second plate of the second capacitor, the second transmission line being in the second metal layer of the integrated circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.