Functional prober chip
US10866273B2 · kind B2 · utility
0Cited by
14References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 9, 2017 |
| Grant date | Dec 15, 2020 |
| Priority date | — |
| Expiry date | Apr 3, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/32
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Systems, devices, and methods for characterizing semiconductor devices and thin film materials. The device consists of multiple probe tips that are integrated on a single substrate. The layout of the probe tips could be designed to match specific patterns on a CMOS chip or sample. The device provides for detailed studies of transport mechanisms in thin film materials and semiconductor devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.