Mold, imprint device, and imprint method
US10866509B2 · kind B2 · utility
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0References
17Claims
0Family size
Assignee
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Key dates
| Filing date | Jun 9, 2017 |
| Grant date | Dec 15, 2020 |
| Priority date | — |
| Expiry date | Feb 17, 2038 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29K2995/0094
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A mold includes a rugged pattern layer, an inorganic sheet layer, and an elastic sheet layer. The inorganic sheet layer is formed of an inorganic material and supports the rugged pattern layer. The elastic sheet layer supports the inorganic sheet layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.