Teppei Iwase
14Patents
2h-index
20Co-inventors
50Inventor score
Filing activity: Jul 23, 2004 → Feb 21, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8283570B2 | Semiconductor assembly and multilayer wiring board | Electricity | 4 | Active |
| US8106521B2 | Semiconductor device mounted structure with an underfill sealing-bonding resin with voids | Electricity | 2 | Active |
| US8264079B2 | Semiconductor device mounted structure and its manufacturing method, semiconductor device mounting method, and pressing tool | Electricity | 2 | Active |
| US9136219B2 | Expanded semiconductor chip and semiconductor device | Electricity | 2 | Active |
| US7904281B2 | Mounting process simulation system and method thereof | Physics | 2 | Active |
| US7873932B2 | Method for analyzing component mounting board | Electricity | 2 | Active |
| US8426965B2 | Semiconductor device mounted structure and its manufacturing method, semiconductor device mounting method, and pressing tool | Electricity | 1 | Active |
| US8766418B2 | Semiconductor device | Electricity | 1 | Active |
| US9950463B2 | Imprinting device | Performing Operations; Transporting | 1 | Active |
| US10578775B2 | Film structural member | Physics | 0 | Active |
| US10866509B2 | Mold, imprint device, and imprint method | Performing Operations; Transporting | 0 | Active |
| US10105874B2 | Imprinting method and imprinting device | Performing Operations; Transporting | 0 | Active |
| US7994638B2 | Semiconductor chip and semiconductor device | Electricity | 0 | Active |
| US8050049B2 | Semiconductor device | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.