Marking position correcting apparatus and method
US10867828B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 27, 2016 |
| Grant date | Dec 15, 2020 |
| Priority date | — |
| Expiry date | Apr 27, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2223/54453
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided is an apparatus and method for correcting a marking position, in which, by measuring and correcting a marking position by using a processing film for position correction, marking may be accurately performed on a position on a semiconductor chip during a marking operation, before a marking operation is performed on semiconductor chips provided on a wafer. The apparatus for correcting a marking position of a wafer includes a support configured to support a processing film for position correction, a laser head configured to emit a laser beam to the processing film for position correction to form a pattern, a vision camera configured to obtain pattern position information, a movable table configured to move the support in a horizontal direction, and a controller configured to compare and match the pattern position information and marking position information set in the laser head.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.