Method and apparatus for bonding semiconductor devices
US10867831B1 · kind B1 · utility
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1References
20Claims
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Assignee
Inventors
Key dates
| Filing date | Aug 14, 2020 |
| Grant date | Dec 15, 2020 |
| Priority date | — |
| Expiry date | Aug 14, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/68381
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for bonding semiconductor devices are disclosed. In an embodiment, the method may include attaching a first die to a flip head of a flip module, flipping the first die with the flip module, removing the first die from the flip module after flipping the first die, inspecting the flip head of the flip module for contamination after removing the first die, cleaning the flip head with an in situ cleaning module after inspecting the flip head, and attaching a second die to the flip head after cleaning the flip head.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.