Method and device for measurement of a plurality of semiconductor chips in a wafer array

US10867873B2 · kind B2 · utility

Assignee

• Osram OLED GMBH · DE

Inventors

• Holger Specht · Bad Abbach, DE
• Roland Zeisel · Tegernheim, DE
• Anton Vogl · Sinzing, DE
• Jens Ebbecke · Rottenburg a. d. Laaber, DE

Key dates

• Filing date: Jul 25, 2017
• Grant date: Dec 15, 2020
• Expiry date: Jul 25, 2037

Classification

• Technology area (CPC G): Physics
• CPC primary: G01R31/311
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A method and a device for measuring a plurality of semiconductor chips in a wafer array are disclosed. In an embodiment a method for measuring the semiconductor chips in a wafer array, wherein the wafer array is arranged on an electrically conductive carrier so that in each case back contacts of the semiconductor chips are contacted by the carrier, wherein a contact structure is arranged on a side of the wafer array facing away from the carrier, and wherein the contact structure includes a contact element and/or a plurality of radiation-emitting measurement semiconductor chips, includes applying a voltage between the contact structure and the carrier and measuring the semiconductor chips depending on a luminous image which is generated by emitted radiation which is caused simultaneously by fluorescence when the semiconductor chips are illuminated or by a radiation-emitting operation of the measurement semiconductor chips when the voltage is applied.