Inventor · Tegernheim, DE

Roland Zeisel

15Patents
1h-index
31Co-inventors
50Inventor score

Filing activity: Apr 21, 2005 → May 23, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US10288671B2 Method and device for inspecting an optoelectronic component arranged on a connection board Physics 3 Active
US10566210B2 Method for structuring a nitride layer, structured dielectric layer, optoelectronic component, etching method for etching layers, and an environment sensor Electricity 0 Active
US12405101B2 Hybrid wire localization length measurement device Physics 0 Active
US11796567B2 Method and device for electrically contacting components in a semiconductor wafer Physics 0 Active
US11378590B2 Device and method for processing a multiplicity of semiconductor chips Physics 0 Active
US10132855B2 Method and device for measuring and optimizing an optoelectronic component Physics 0 Active
US11011573B2 Radiation-emitting component Electricity 0 Active
US10651342B2 Optoelectronic semiconductor chip Electricity 0 Active
US10867873B2 Method and device for measurement of a plurality of semiconductor chips in a wafer array Physics 0 Active
US12356762B2 Optoelectronic component and method for producing an optoelectronic component Electricity 0 Active
US9853018B2 Optoelectronic semiconductor chip and optoelectronic component Electricity 0 Active
US10872783B2 Method for structuring a nitride layer, structured dielectric layer, optoelectronic component, etching method for etching layers, and an environment sensor Electricity 0 Active
US7741227B2 Process for structuring at least one year as well as electrical component with structures from the layer Electricity 0 Expired
US12426408B2 Optoelectronic semiconductor component Electricity 0 Active
US10580938B2 Light-emitting diode chip, and method for manufacturing a light-emitting diode chip Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.