Targeted recall of semiconductor devices based on manufacturing data
US10867877B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 18, 2018 |
| Grant date | Dec 15, 2020 |
| Priority date | — |
| Expiry date | Jul 18, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2223/54433
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A system for providing a targeted recall includes a metrology sub-system for performing in-line measurements on semiconductor dies after one or more fabrication steps to generate in-line measurement profiles, a failure analysis sub-system for determining a manufacturing fingerprint of a failed die, and a controller. The metrology sub-system may further perform one or more measurements of the semiconductor dies after one or more packaging steps to generate package characterization profiles. The controller may generate manufacturing fingerprints for the semiconductor dies based on the in-line measurement profiles and the package characterization profiles, which are referenced to unique electronic chip identifiers. The controller may further identify at-risk dies by comparing the manufacturing fingerprints of the semiconductor dies with the manufacturing fingerprint of the failed die and direct a targeted recall for the one or more at-risk dies.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.