Patent · US Active

Component carrier comprising at least one heat pipe and method for producing said component carrier

US10867888B2 · kind B2 · utility

0Cited by

4References

20Claims

0Family size

Assignee

AT&S Austria Technologie & Systemtechnik Aktiengesellschaft · AT

Inventors

Jonathan Silvano de Sousa · Wien, AT
Bernhard Reitmaier · Möderbrugg, AT
Erich Schlaffer · Bachern, AT
Johannes Stahr · Kindberg, AT
Wolfgang Schrittwieser · Kapfenberg, AT
Gerald Weidinger · Leoben, AT
Alexander Kasper · Graz, AT
Gernot Grober · Graz, AT

Key dates

Filing date	Apr 17, 2020
Grant date	Dec 15, 2020
Priority date	—
Expiry date	Apr 17, 2040

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02E60/14
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

The invention refers to a component carrier comprising at least one heat pipe, wherein the at least one heat pipe has at least a largely cylindrical heat pipe section with a largely cylindrical profile with an outer diameter. The at least one heat pipe is embedded within a recess of at least one inner layer or is surface-mounted on an outer layer of said component carrier, wherein at least the largely cylindrical heat pipe section of the heat pipe is thermoconductively coupled by means of at least one adapter means that directly contacts the heat pipe with at least one layer of the component carrier. Furthermore the invention refers to several methods for producing said component carrier.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.