Patent · US Active

Semiconductor module and method for producing the same

US10867902B2 · kind B2 · utility

2Cited by

2References

15Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Olaf Hohlfeld · Warstein, DE
Peter Kanschat · Soest, DE

Key dates

Filing date	Dec 14, 2018
Grant date	Dec 15, 2020
Priority date	—
Expiry date	Dec 14, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/1815
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A power semiconductor module arrangement including two or more individual semiconductor devices each semiconductor device having a lead frame, a semiconductor body arranged on the lead frame, and a molding material enclosing the semiconductor body and at least part of the lead frame. The power semiconductor module arrangement further includes a frame surrounding the two or more individual semiconductor devices, and a casting compound at least partly filling a capacity within the frame, thereby at least partly enclosing the two or more individual semiconductor devices.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.