Patent · US Active

Component magnetic shielding for microelectronic devices

US10867934B2 · kind B2 · utility

2Cited by

1References

12Claims

0Family size

Assignee

Intel IP Corporation · US

Inventors

Saravana Maruthamuthu · Munich, DE
Thomas Ort · Veitsbronn, DE
Andreas Wolter · Regensburg, DE
Andreas Augustin · Munich, DE
Veronica Sciriha · Munich, DE
Bernd Waidhas · Nittendorf, DE

Key dates

Filing date	Mar 27, 2018
Grant date	Dec 15, 2020
Priority date	—
Expiry date	Mar 27, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3025
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A microelectronic device may include a substrate, a component, a first plate, a second plate, and a shield. The component may be disposed at least partially within the substrate. The first plate may be disposed on a first side of the component. The second plate may be disposed on a second side of the component. The shield may be disposed around at least a portion of a periphery of the component.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.