Inventor · Veitsbronn, DE

Thomas Ort

15Patents

2h-index

14Co-inventors

47Inventor score

Filing activity: Aug 31, 2010 → Feb 26, 2024

Most-cited inventions

Patent	Title	Area	Cited by	Status
US10546817B2	Face-up fan-out electronic package with passive components using a support	Electricity	2	Active
US10867934B2	Component magnetic shielding for microelectronic devices	Electricity	2	Active
US10665522B2	Package including an integrated routing layer and a molded routing layer	Electricity	2	Active
US8598709B2	Method and system for routing electrical connections of semiconductor chips	Electricity	1	Active
US10403580B2	Molded substrate package in fan-out wafer level package	Electricity	1	Active
US11404339B2	Fan out package with integrated peripheral devices and methods	Electricity	0	Active
US11508637B2	Fan out package and methods	Electricity	0	Active
US11211337B2	Face-up fan-out electronic package with passive components using a support	Electricity	0	Active
US10699980B2	Fan out package with integrated peripheral devices and methods	Electricity	0	Active
US12057364B2	Package formation methods including coupling a molded routing layer to an integrated routing layer	Electricity	0	Active
US10720393B2	Molded substrate package in fan-out wafer level package	Electricity	0	Active
US11764187B2	Semiconductor packages, and methods for forming semiconductor packages	Electricity	0	Active
US11955395B2	Fan out package with integrated peripheral devices and methods	Electricity	0	Active
US12362251B2	Fan out package with integrated peripheral devices and methods	Electricity	0	Active
US8415803B2	Method and system for routing electrical connections of semiconductor chips	General	0	Revoked

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.