Die structure, die stack structure and method of fabricating the same
US10867943B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 15, 2018 |
| Grant date | Dec 15, 2020 |
| Priority date | — |
| Expiry date | Jun 15, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2225/06565
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided is a die structure including a die, a bonding structure, and a protection structure. The die includes a substrate and a metal feature disposed over the substrate. The bonding structure is disposed over the die. The bonding structure includes a bonding dielectric layer and a bonding metal layer disposed in the bonding dielectric layer. The bonding metal layer is electrically connected to the metal feature of the die. The protection structure is disposed between a top portion of the bonding metal layer and a top portion of the bonding dielectric layer. A die stack structure and a method of fabricating the die structure are also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.