Package structures and methods of forming the same
US10867965B2 · kind B2 · utility
17Cited by
12References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 30, 2018 |
| Grant date | Dec 15, 2020 |
| Priority date | — |
| Expiry date | Dec 11, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An embodiment is a method including bonding a first die to a first side of an interposer using first electrical connectors, bonding a second die to first side of the interposer using second electrical connectors, attaching a first dummy die to the first side of the interposer adjacent the second die, encapsulating the first die, the second die, and the first dummy die with an encapsulant, and singulating the interposer and the first dummy die to form a package structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.