Semiconductor packages having dummy connectors and methods of forming same

US10867976B2 · kind B2 · utility

Assignee

• TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. · TW

Inventors

• Chen-Shien Chen · Hsinchu, TW
• Hsiu-Jen Lin · Zhubei City, TW
• Ming-Chih Yew · Rochester, US
• Ming-Da Cheng · Zhubei City, TW
• Yi-Jen Lai · Hsinchu, TW
• Yu-Tse Su · Chiayi, TW
• Sey-Ping Sun · Austin, US
• Yang-Che Chen · Hsinchu, TW

Key dates

• Filing date: Dec 11, 2019
• Grant date: Dec 15, 2020
• Expiry date: Dec 11, 2039

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/3511
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An embodiment package includes a first package. The first package includes a first integrated circuit die, an encapsulant around the first integrated circuit die, and redistribution layers over the encapsulant and the first integrated circuit die. The package also includes a second package bonded to the first package by a plurality of functional connectors. The functional connectors and the redistribution layers electrically connect a second integrated circuit die of the second package to the first integrated circuit die. The package also includes a plurality of dummy connectors disposed between the first package and the second package. One end of each of the plurality of dummy connectors facing the first package is physically separated from the first package.