Yang-Che Chen
27Patents
3h-index
19Co-inventors
56Inventor score
Filing activity: Nov 21, 2013 → Jul 27, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10276548B2 | Semiconductor packages having dummy connectors and methods of forming same | Electricity | 7 | Active |
| US10510734B2 | Semiconductor packages having dummy connectors and methods of forming same | Electricity | 4 | Active |
| US11626343B2 | Semiconductor device with enhanced thermal dissipation and method for making the same | Electricity | 4 | Active |
| US11088037B2 | Semiconductor device having probe pads and seal ring | Electricity | 3 | Active |
| US10867976B2 | Semiconductor packages having dummy connectors and methods of forming same | Electricity | 2 | Active |
| US10937858B2 | Method for manufacturing semiconductor and structure thereof | Electricity | 2 | Active |
| US10347548B2 | Integrated circuit package structure and testing method using the same | Electricity | 2 | Active |
| US11769698B2 | Method of testing semiconductor package | Electricity | 1 | Active |
| US9254999B2 | Mechanisms for forming micro-electro mechanical device | Performing Operations; Transporting | 1 | Active |
| US11908884B2 | Inductive device | Electricity | 0 | Active |
| US11854913B2 | Method for detecting defects in semiconductor device | Electricity | 0 | Active |
| US11482461B2 | Semiconductor package and method for making the same | Electricity | 0 | Active |
| US11274037B2 | Dual micro-electro mechanical system and manufacturing method thereof | Performing Operations; Transporting | 0 | Active |
| US10629673B2 | Method for manufacturing semiconductor and structure thereof | Electricity | 0 | Active |
| US11322576B2 | Inductive device | Electricity | 0 | Active |
| US11776919B2 | Semiconductor package | Electricity | 0 | Active |
| US11450626B2 | Semiconductor package | Electricity | 0 | Active |
| US12183655B2 | Semiconductor device with enhanced thermal dissipation and method for making the same | Electricity | 0 | Active |
| US12243788B2 | Method of testing semiconductor package | Electricity | 0 | Active |
| US10699977B2 | Method of detecting delamination in an integrated circuit package structure | Electricity | 0 | Active |
| US12426283B2 | Semiconductor structure and method of manufacturing the same | Electricity | 0 | Active |
| US11837526B2 | Semiconductor package structure and method for manufacturing the same | Electricity | 0 | Active |
| US11993512B2 | Dual micro-electro mechanical system and manufacturing method thereof | Performing Operations; Transporting | 0 | Active |
| US12027433B2 | Semiconductor package and method for making the same | Electricity | 0 | Active |
| US10937772B2 | Semiconductor package and method for manufacturing the same | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.