Electronic device and manufacturing method thereof
US10868353B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 18, 2019 |
| Grant date | Dec 15, 2020 |
| Priority date | — |
| Expiry date | May 10, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q21/065
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic device and a manufacturing method thereof are provided. The electronic device includes a chip package, an antenna pattern, and an insulating layer. The chip package includes a semiconductor die and an insulating encapsulation enclosing the semiconductor die. The antenna pattern is electrically coupled to the chip package, where a material of the antenna pattern comprises a conductive powder having fused metal particles. The insulating layer disposed between the chip package and the antenna pattern, where the antenna pattern includes a first surface in contact with the insulating layer, and a second surface opposite to the first surface, and a surface roughness of the second surface is greater than a surface roughness of the first surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.