Inventor · Tainan, TW

Ming-Che Ho

112Patents
8h-index
102Co-inventors
83Inventor score

Filing activity: Mar 9, 1998 → Feb 7, 2024

Most-cited inventions

PatentTitleAreaCited byStatus
US8981559B2 Package on package devices and methods of packaging semiconductor dies Electricity 50 Active
US8659155B2 Mechanisms for forming copper pillar bumps Electricity 22 Active
US8172641B2 CMP by controlling polish temperature Performing Operations; Transporting 18 Active
US6233167A Power-transforming device Electricity 17 Expired
US8827695B2 Wafer's ambiance control Emerging Cross-Sectional Technologies 12 Active
US8405199B2 Conductive pillar for semiconductor substrate and method of manufacture Electricity 10 Active
US8609526B2 Preventing UBM oxidation in bump formation processes Electricity 10 Active
US9257401B2 Method of fabricating bump structure and bump structure Electricity 8 Active
US9159686B2 Crack stopper on under-bump metallization layer Electricity 8 Active
US10049894B2 Package structures and methods for forming the same Electricity 7 Active
US9099396B2 Post-passivation interconnect structure and method of forming the same Electricity 6 Active
US10868353B2 Electronic device and manufacturing method thereof Electricity 6 Active
US9397080B2 Package on package devices and methods of packaging semiconductor dies Electricity 6 Active
US8641920B2 Polishing composition for planarizing metal layer Chemistry; Metallurgy 6 Active
US6062300A Evenly heat-dissipating apparatus Electricity 5 Expired
US8569897B2 Protection layer for preventing UBM layer from chemical attack and oxidation Electricity 5 Active
US8791579B2 Adjusting sizes of connectors of package components Electricity 5 Active
US10297544B2 Integrated fan-out package and method of fabricating the same Electricity 5 Active
US9430605B2 Adjusting sizes of connectors of package components Electricity 4 Active
US8993431B2 Method of fabricating bump structure Electricity 4 Active
US10163832B1 Integrated fan-out package, redistribution circuit structure, and method of fabricating the same Electricity 4 Active
US9601355B2 Via structure for packaging and a method of forming Electricity 4 Active
US9030010B2 Packaging devices and methods Electricity 4 Active
US9472524B2 Copper-containing layer on under-bump metallization layer Electricity 4 Active
US9935047B2 Bonding structures and methods forming the same Electricity 4 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.