Spatial-frequency matched wafer alignment marks, wafer alignment and overlay measurement and processing using multiple different mark designs on a single layer
US10871708B2 · kind B2 · utility
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2References
40Claims
0Family size
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Key dates
| Filing date | Jan 24, 2018 |
| Grant date | Dec 22, 2020 |
| Priority date | — |
| Expiry date | Jun 24, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2223/54426
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Alignment patterns that are selected based on device pattern spatial frequencies are defined on a reticle. The alignment patterns can include periodic arrays of lines, spaces, dots, of other pattern elements. Such patterns can be defined as sets associated with a common spatial frequency or frequency range, or some or all sets can include alignment marks having mark elements associated with different spatial frequencies.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.