System and method for monitoring operation conditions of semiconductor manufacturing apparatus
US10872793B2 · kind B2 · utility
1Cited by
1References
20Claims
0Family size
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Key dates
| Filing date | Sep 12, 2018 |
| Grant date | Dec 22, 2020 |
| Priority date | — |
| Expiry date | Sep 21, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R1/08
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In a method of operating an apparatus for manufacturing or analyzing semiconductor wafers, sound in a process chamber of the apparatus during an operation of the apparatus is detected. An electrical signal corresponding to the detected sound is acquired by a signal processor. The acquired electrical signal is processed by the signal processor. An event during the operation of the apparatus is detected based on the processed electrical signal. The operation of the apparatus is controlled according to the detected event.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.