Chih-Yu Wang
35Patents
3h-index
45Co-inventors
59Inventor score
Filing activity: Mar 2, 2006 → Aug 11, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9527721B2 | Movement microelectromechanical systems (MEMS) package | Electricity | 11 | Active |
| US9880192B2 | Method of manufacturing a motion sensor device | Emerging Cross-Sectional Technologies | 4 | Active |
| US8427143B2 | Fixing structure for signal wires of a resolver | Physics | 4 | Active |
| US10155656B2 | Inter-poly connection for parasitic capacitor and die size improvement | Performing Operations; Transporting | 3 | Active |
| US11543363B2 | Systems and methods for wafer bond monitoring | Electricity | 3 | Active |
| US11565365B2 | System and method for monitoring chemical mechanical polishing | Electricity | 1 | Active |
| US10131536B2 | Heater design for MEMS chamber pressure control | Electricity | 1 | Active |
| US8960003B2 | Motion sensor device and methods for forming the same | Emerging Cross-Sectional Technologies | 1 | Active |
| US7467456B2 | Method of arranging a resolver | Emerging Cross-Sectional Technologies | 1 | Active |
| US10872793B2 | System and method for monitoring operation conditions of semiconductor manufacturing apparatus | Electricity | 1 | Active |
| US11407636B2 | Inter-poly connection for parasitic capacitor and die size improvement | Performing Operations; Transporting | 1 | Active |
| US11145526B2 | Method of analyzing a manufacturing of a semiconductor structure | Physics | 1 | Active |
| US10797008B2 | Semiconductor package and manufacturing method thereof | Electricity | 1 | Active |
| US9090452B2 | Mechanism for forming MEMS device | Performing Operations; Transporting | 0 | Active |
| US10985115B2 | Semiconductor package and manufacturing method thereof | Electricity | 0 | Active |
| US11615965B2 | Semiconductor FinFET device and method | Electricity | 0 | Active |
| US11815471B2 | Systems and methods for wafer bond monitoring | Electricity | 0 | Active |
| US11508671B2 | Semiconductor package and manufacturing method thereof | Electricity | 0 | Active |
| US12080609B2 | Method of detecting photoresist scum, method of forming semiconductor package and photoresist scum detection apparatus | Electricity | 0 | Active |
| US11100639B2 | Method for skin examination based on RBX color-space transformation | Physics | 0 | Active |
| US12327729B2 | Semiconductor FinFET device and method | Electricity | 0 | Active |
| US12085518B2 | Systems and methods for wafer bond monitoring | Electricity | 0 | Active |
| US10532925B2 | Heater design for MEMS chamber pressure control | Electricity | 0 | Active |
| US8159095B2 | Hiding structure for positioning signal conversion mechanism of a torque motor | Electricity | 0 | Active |
| US11688413B2 | Method and system for audio recognition of arcing during semiconductor process | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.