Fan-out antenna packaging structure and preparation method thereof
US10872867B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 25, 2018 |
| Grant date | Dec 22, 2020 |
| Priority date | — |
| Expiry date | Feb 14, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/12105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure provides a fan-out antenna packaging structure and a method for preparing the same. The fan-out antenna packaging structure comprises: a semiconductor chip; a plastic packaging material layer comprising a first surface and an opposite second surface, wherein the plastic packaging material layer packages a periphery of the semiconductor chip; a metal connecting pole located in the plastic packaging material layer and running through the plastic packaging material layer from top to bottom; an antenna structure located on the first surface of the plastic packaging material layer and electrically connected with the metal connecting pole; are distribution layer located on the second surface of the plastic packaging material layer and electrically connected with the semiconductor chip and the metal connecting pole; and a solder bump located on a surface, insulated from the plastic packaging material layer, of the redistribution layer, and electrically connected with the redistribution layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.