Fan-out antenna packaging structure and preparation method thereof
US10872868B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 25, 2018 |
| Grant date | Dec 22, 2020 |
| Priority date | — |
| Expiry date | Jan 3, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1533
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure provides a fan-out antenna packaging structure and a method for preparing the same. The fan-out antenna packaging structure comprises: a semiconductor chip; a plastic packaging material layer, comprising a first surface and a second surface opposite to the first surface, wherein the plastic packaging material layer wraps around a periphery of the semiconductor chip; a metal connecting wire disposed through the plastic packaging material layer from top to bottom; an antenna structure, located on the first surface of the plastic packaging material layer and electrically connected with the metal connecting wire; a redistribution layer, located on the second surface of the plastic packaging material layer and electrically connected with the semiconductor chip and the metal connecting wire; and a solder ball bump, located on a surface of the redistribution layer, electrically connected with the redistribution layer and insulated from the plastic packaging material layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.