Debris-removal groove for CMP polishing pad

US10875146B2 · kind B2 · utility

Assignee

• Rohm and Haas Electronic Materials CMP Holdings, Inc. · US

Inventors

• Lee Melbourne Cook · Spencer, US
• Yuhua Tong · Hockessin, US
• Joseph So · Newark, US
• Jeffrey James Hendron · Elkton, US
• Patricia Connell · Rising Sun, US

Key dates

• Filing date: Mar 24, 2016
• Grant date: Dec 29, 2020
• Expiry date: Jun 13, 2036

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B24D11/00
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

The invention provides a polishing pad suitable for polishing or planarizing at least one of semiconductor, optical and magnetic substrates. The polishing pad includes a polishing layer having a polymeric matrix, a thickness and a polishing track representing a working region of the polishing layer for polishing or planarizing. Radial drainage grooves extend through the polishing track facilitate polishing debris removal through the polishing track and underneath the at least one of semiconductor, optical and magnetic substrates and then beyond the polishing track toward the perimeter of the polishing pad during rotation of the polishing pad.