Joseph So
18Patents
6h-index
32Co-inventors
66Inventor score
Filing activity: Aug 3, 2000 → Sep 11, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6749485B1 | Hydrolytically stable grooved polishing pads for chemical mechanical planarization | Emerging Cross-Sectional Technologies | 72 | Expired |
| US6736709B1 | Grooved polishing pads for chemical mechanical planarization | Performing Operations; Transporting | 57 | Expired |
| US6893328B2 | Conductive polishing pad with anode and cathode | Emerging Cross-Sectional Technologies | 33 | Expired |
| US7387964B2 | Copper polishing cleaning solution | Chemistry; Metallurgy | 22 | Expired |
| US6475069B1 | Control of removal rates in CMP | Performing Operations; Transporting | 9 | Expired |
| US6530824B2 | Method and composition for polishing by CMP | Electricity | 6 | Expired |
| US8257152B2 | Silicate composite polishing pad | Performing Operations; Transporting | 5 | Active |
| US6769968B2 | Interchangeable conditioning disk apparatus | Performing Operations; Transporting | 5 | Expired |
| US7303993B2 | Chemical mechanical polishing compositions and methods relating thereto | Electricity | 5 | Expired |
| US8202334B2 | Method of forming silicate polishing pad | Performing Operations; Transporting | 4 | Active |
| US7384871B2 | Chemical mechanical polishing compositions and methods relating thereto | Chemistry; Metallurgy | 3 | Expired |
| US7084059B2 | CMP system for metal deposition | Electricity | 3 | Expired |
| US11548114B1 | Compressible non-reticulated polyurea polishing pad | Electricity | 1 | Active |
| US9446498B1 | Chemical mechanical polishing pad with window | Performing Operations; Transporting | 1 | Active |
| US8357446B2 | Hollow polymeric-silicate composite | Emerging Cross-Sectional Technologies | 0 | Active |
| US11638978B2 | Low-debris fluopolymer composite CMP polishing pad | Electricity | 0 | Active |
| US11897082B2 | Heterogeneous fluoropolymer mixture polishing pad | Electricity | 0 | Active |
| US10875146B2 | Debris-removal groove for CMP polishing pad | Performing Operations; Transporting | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.