Thermosetting resin composition, prepreg, laminated board, printed wiring board, and high speed communication-compatible module
US10876000B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | May 30, 2017 |
| Grant date | Dec 29, 2020 |
| Priority date | — |
| Expiry date | Jun 18, 2037 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2207/04
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A thermosetting resin composition containing: (A) an addition reaction product of a maleimide compound having at least two N-substituted maleimide groups in one molecule (a1) and an amine compound having at least two primary amino groups in one molecule (a2), (B) a thermoplastic elastomer, and (C) a copolymer resin having a structural unit derived from an aromatic vinyl compound and a structural unit derived from a carboxylic acid anhydride.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.